Meizu new flagship PRO 6 has officially started selling last week, this phone features a MediaTek Helixo X25 (MT6797T) processor, 4GB of memory, there are two versions of 32GB and 64GB options, the priced at 2499 Yuan and 2799 Yuan. It also includes a 5.2-inch Samsung 1080P screen, 10 LED ring flash and a 2560mAh battery, measure of 147.7 * 70.8 * 7.25mm.
Now, it168 has taken apart the phone, let us explore its workmanship and materials.
In accordance with the disassemble experts, Meizu PRO 6 has very outstanding and craftsmanship. The phone is thinner and the internal is compact.
Remove the screws next to the Micro USB port of the phone with a screw driver.
Then, remove the SIM card tray.
Meizu Pro 6’s display assembly is fixed on its body with snaps and double-sided adhesive tape. Using a suction cup and a guitar pick to separate the display assembly from its body.
Using the guitar pick to separate the display assembly along the edge.
Lift up the display assembly. Be careful, there are two cables still connected to the phone body.
Disconnect the LCD cable and touch cable.
You can remove the display assembly completely.
Here’s Meizu Pro 6 display assembly.
There is a metal board on the back of the screen. The metal board can make the metal board fastened; on the other hand, it can also radiate heat.
The big one is the LCD cable, the other is touch cable.
When the display assembly was removed, you can get access to the motherboard, battery, speaker and home button.
The internal structure is quite compact, the battery and motherboard are covering by a layer of thermal graphite sheet.
Meizu PRO 6 USB Type-C port, the circuit of the USB Type-C port is relatively complicated than microUSB port and the functions it provides are also richer than Micro USB port.
Meizu Pro 6’s battery is fixed to the phone’s metal shell with double-sided adhesive tape.
The battery capacity of Meizu Pro 6 is 2560mAh.
After removing the sound chamber of the speaker, we can see the complete circuit of USB Type-C port. There is also a control chip behind the port.
Meizu Pro 6’s sound chamber, the chamber is already integrated with the speaker.
To remove the motherboard, you should remove the connecting cables.
From left to right, they are button port, the tiny PCB connecting cable port and battery port near the bottom.
Meizu Pro 6’s camera is also covered with copper foil which is mainly to radiate the heat and shield the signal.
Meizu Pro 6’s vibrator is in the upper left corner of the phone.
After removing the motherboard, we can see Meizu Pro 6’s back cover. The back cover uses the new design and the signal overflow spot uses injection molding process.
The back of the motherboard is also covered with copper foil to help with the heat radiation.
Due to the thickness of the body, motherboard design is more compact, you can see the front of the motherboard is covered with the metal shield.
You can find a date on the motherboard, March 1, 2016, this should be the produce date of the motherboard.
The back of the motherboard is also covered with thermal graphite sheet.
Meizu Pro 6 first uses LED flash ring design, we can see ten dual-color temperature LED flash, the laser focus component is in the middle.
Remove the metal shield. We can see the thermal silicone grease that help the heat radiation on the metal shield.
After removing the metal shield, you can access to the connector, CPU, power management component and other components on the front of the motherboard.
The back of the motherboard are the battery charging and discharging management chips. This part takes much place and the rest is the base-band of the phone.
Meizu pro 6 uses Helio X25 processor. The processor and the phone’s memory chip are sealed together.
After disassembling, we can see the Samsung memory chip, the CPU chip is under the memory chip.
MT6351V is a power management chip. It works with Helio X25 processor, taking charge of the power supply management of CPU and memory.
We find there are two BQ25892 battery charging chips from Texas Instruments on the front of the motherboard. BQ25892 is a highly integrated 5A battery charging management and system power circuit management chips, supporting 5V/9V/12V charging voltage.
Dialog DA9214 is a high-power power management chip, offers dual-circuit 10A output, supports 2.8V-5.5V voltage output. This chip and two BQ25892 chips make dual-charging circuit, the whole design is more complex than the common fast charging.
NXP TFA9911 is a smart audio chip, mainly offers smart audio solution for Meizu Pro 6’s loud speaker, offering high as 7.2W audio output power and integrating amplitude control, real-time temperature protection and so on, making sure the phone can work safely even the output is close to the peak.
CS43L36 is a chip that integrates DAC and earphone power amplifier. Although there is no independent DAC and operational amplifier, it still provides excellent audio quality.
Meizu Pro 6’s main camera uses IMX230CMOS sensor, offering 21.16MP resolution and the volume of the camera is also enlarged. Besides, Meizu Pro 6 uses 5MP front camera.